JPH0356338Y2 - - Google Patents
Info
- Publication number
- JPH0356338Y2 JPH0356338Y2 JP2083687U JP2083687U JPH0356338Y2 JP H0356338 Y2 JPH0356338 Y2 JP H0356338Y2 JP 2083687 U JP2083687 U JP 2083687U JP 2083687 U JP2083687 U JP 2083687U JP H0356338 Y2 JPH0356338 Y2 JP H0356338Y2
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- gate
- sectional area
- cross
- runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2083687U JPH0356338Y2 (en]) | 1987-02-17 | 1987-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2083687U JPH0356338Y2 (en]) | 1987-02-17 | 1987-02-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63128013U JPS63128013U (en]) | 1988-08-22 |
| JPH0356338Y2 true JPH0356338Y2 (en]) | 1991-12-18 |
Family
ID=30816715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2083687U Expired JPH0356338Y2 (en]) | 1987-02-17 | 1987-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356338Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7570959B2 (ja) * | 2021-03-29 | 2024-10-22 | 株式会社吉野工業所 | バリアキャップ |
-
1987
- 1987-02-17 JP JP2083687U patent/JPH0356338Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63128013U (en]) | 1988-08-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR970060461A (ko) | 에폭시 수지로 캡슐화된 반도체 장치의 제조 방법 | |
| HK106297A (en) | Method of encapsulating a semiconductor element in resin or sealing it therewith, and a mould therefor | |
| US4894704A (en) | Lead frame having projections for resin molding | |
| JPH0575565B2 (en]) | ||
| JP3411448B2 (ja) | 半導体素子の樹脂封止金型及び半導体装置の製造方法 | |
| JPH0356338Y2 (en]) | ||
| JPH032048B2 (en]) | ||
| JPH1158449A (ja) | 半導体装置の樹脂封止成形金型 | |
| JPS614234A (ja) | 半導体素子の樹脂モ−ルド成形方法及び半導体リ−ドフレ−ム | |
| JP2598988B2 (ja) | 電子部品の樹脂封止成形方法 | |
| JPS6124241A (ja) | 半導体装置の樹脂封止金型 | |
| JPH0420587Y2 (en]) | ||
| JPH0629338A (ja) | 半導体装置製造用樹脂封止金型及びそれを用いた製造方法 | |
| JPH0610682Y2 (ja) | 樹脂封止形半導体装置成形用モールド金型 | |
| JP2927250B2 (ja) | 半導体装置の樹脂封止金型 | |
| KR100653607B1 (ko) | 복수의 보조-런너를 갖는 반도체 칩 패키지용 수지 성형장치 | |
| JP2545409Y2 (ja) | 半導体素子封入金型 | |
| JPS59108323A (ja) | 半導体樹脂封止用金型 | |
| JP2954993B2 (ja) | 樹脂封止型半導体装置のモールド金型 | |
| JPS5692014A (en) | Resin sealing mold | |
| KR970002139B1 (ko) | 반도체 패키지용 리드 프레임 | |
| JPH05144860A (ja) | モールド金型 | |
| JPH0415620B2 (en]) | ||
| JPS634659A (ja) | リ−ドフレ−ム | |
| JPH0453239A (ja) | 樹脂封止型半導体装置用のモールド金型 |